GENESIS Silicon 900 heat sink compound Thermal paste 12.8 W/m·K 8 g

Περιγραφή

Features

Density: 2.8 g/cm³

Type: Thermal paste

Operating temperature (T-T): -50 - 250 °C

Thermal conductivity: 12.8 W/m·K

Weight & dimensions

Weight: 8 g

Packaging data

Scraper: Yes

Quantity per pack: 1 pc(s)

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