SO-DIMM

FeaturesComponent for: LaptopProduct colour: White, Grey, Blue, Black, GoldMemory form factor: 260-pin SO-DIMMInternal memory: 32 GBLead plating: Gold..

FeaturesComponent for: LaptopMemory form factor: 260-pin SO-DIMMInternal memory: 16 GBMemory layout (modules x size): 1 x 16 GBMemory clock speed: 240..

FeaturesComponent for: LaptopMemory form factor: 260-pin SO-DIMMMemory layout (modules x size): 2 x 8 GBInternal memory: 16 GBMemory clock speed: 2400..

FeaturesMemory layout (modules x size): 1 x 4 GBInternal memory: 4 GBMemory clock speed: 1600 MHzProduct colour: GreenCAS latency: 11Memory voltage: 1..

FeaturesModule configuration: 512M x 8Memory layout (modules x size): 1 x 8 GBComponent for: LaptopBuffered memory type: Unregistered (unbuffered)Memo..

FeaturesMemory clock speed: 2400 MHzECC: NoInternal memory: 8 GBCAS latency: 17Buffered memory type: Unregistered (unbuffered)Memory layout (modules x..

FeaturesMemory form factor: 260-pin SO-DIMMECC: NoMemory layout (modules x size): 1 x 16 GBMemory voltage: 1.2 VBuffered memory type: Unregistered (un..

FeaturesECC: NoMemory layout (modules x size): 1 x 32 GBCAS latency: 22Component for: PCInternal memory: 32 GBInternal memory type: DDR4Memory clock s..

FeaturesCAS latency: 22ECC: NoMemory form factor: 260-pin SO-DIMMMemory layout (modules x size): 1 x 8 GBMemory clock speed: 3200 MHzComponent for: La..

FeaturesMemory voltage: 1.1 VMemory form factor: 262-pin SO-DIMMCAS latency: 40Internal memory: 32 GBComponent for: LaptopInternal memory type: DDR5On..

FeaturesModule configuration: 2048M x 8Memory layout (modules x size): 1 x 16 GBSPD profile: YesECC: NoComponent for: PCMemory form factor: 288-pin DI..

FeaturesCAS latency: 19Memory clock speed: 2666 MHzMemory layout (modules x size): 1 x 16 GBMemory voltage: 1.2 VWindows operating systems supported: ..

FeaturesComponent for: LaptopMemory layout (modules x size): 1 x 32 GBCAS latency: 46Internal memory: 32 GBInternal memory type: DDR5Memory clock spee..

FeaturesCooling type: HeatsinkInternal memory type: DDR4Memory layout (modules x size): 1 x 16 GBMemory clock speed: 3200 MHzWindows operating systems..

FeaturesInternal memory type: DDR4Memory channels: Dual-channelECC: NoCooling type: HeatsinkCAS latency: 20Memory layout (modules x size): 2 x 16 GBCo..

FeaturesRow cycle time: 45.75 nsIntel Extreme Memory Profile (XMP) version: 2.0Memory data transfer rate: 3200 MT/sRefresh row cycle time: 350 nsProgr..

FeaturesOn-Die ECC: YesInternal memory: 16 GBMemory form factor: 262-pin SO-DIMMCooling type: HeatsinkECC: NoIntel Extreme Memory Profile (XMP): YesCo..

FeaturesInternal memory: 32 GBIntel Extreme Memory Profile (XMP): YesMemory data transfer rate: 3200 MT/sMemory layout (modules x size): 1 x 32 GBProg..

FeaturesOn-Die ECC: YesMemory data transfer rate: 5600 MT/sJEDEC standard: YesProgramming power voltage (VPP): 1.8 VSPD profile: YesLead plating: Gold..

FeaturesRow cycle time: 48 nsComponent for: LaptopModule configuration: 4096M x 64Memory voltage: 1.1 VBuffered memory type: Unregistered (unbuffered)..

FeaturesBacklight: NoIntel Extreme Memory Profile (XMP) version: 2.0Row active time: 26.25 nsMemory form factor: 260-pin SO-DIMMCooling type: Heatsink..

FeaturesOn-Die ECC: YesMemory form factor: 262-pin SO-DIMMJEDEC standard: YesLead plating: GoldCooling type: HeatsinkMemory layout (modules x size): 2..

FeaturesComponent for: LaptopMemory clock speed: 3200 MHzECC: NoInternal memory type: DDR4Memory layout (modules x size): 1 x 16 GBCAS latency: 22Inte..

Technical detailsDoesn't contain: HalogenSustainability certificates: RoHSFeaturesECC: NoComponent for: LaptopMemory voltage: 1.2 VRow cycle time: 45...

FeaturesCAS latency: 22Lead plating: GoldECC: NoMemory form factor: 260-pin SO-DIMMBuffered memory type: Unregistered (unbuffered)Memory clock speed: ..

FeaturesMemory form factor: 204-pin SO-DIMMInternal memory: 8 GBMemory clock speed: 1600 MHzInternal memory type: DDR3ECC: NoComponent for: LaptopMemo..

FeaturesBuffered memory type: Unregistered (unbuffered)CAS latency: 19Internal memory: 16 GBECC: NoRoHS compliance: YMemory layout (modules x size): 1..